The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 09, 1998
Filed:
Apr. 24, 1996
Hirohiko Kikuchi, Omiya, JP;
Kazuhiro Saito, Omiya, JP;
Kansei Corporation, Omiya, JP;
Abstract
An air bag cover (21) is provided which covers an air bag device and consists of a core layer (23) made of hard resin and a skin layer (22) made of soft resin. The air bag cover (21) has a lid (21a) cracked and opened by actuation of the air bag device. The lid (21a) has cracked-open portions (26) along which the lid (21a) is cracked by pressure generated when the air bag is inflated and a hinge portion (24) on which the lid (21a) is opened and by which the lid (21a) is held. The hinge portion (24) has hinge holes (22a) through which the soft resin of skin layer (22) flows onto the back surface of the core layer (23). A method of molding the air bag cover (21) takes first and second stages. In the first step, after a pair of molds are clamped, molten hard resin for a core layer (23) is injected into a cavity of one of the molds. The hard resin is cooled and hardened to form the core layer (23). In the second step, after the molds are opened, a core die component (35c) of the mold used in the first step is moved and brought into contact with a cavity die component (35b) of the other mold. Thereafter, molten soft resin for a skin layer (22) is injected into a space between the core layer (23) formed on the core die component (35c) and the cavity die component (35b) in order to form the skin layer (22).