The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 02, 1998
Filed:
Jun. 07, 1995
Yuji Okawa, Ibaraki, JP;
Nitto Denko Corporation, Osaka, JP;
Abstract
A method for producing a semiconductor element, comprising treating a lead frame or a semiconductor wafer or a semiconductor chip, or a lead frame and a semiconductor chip in combination, with at least one package crack-preventing compound selected from compounds having a reactive group, acids, derivatives at a group due to which said acid assumes acidity, siloxane derivatives of the formula (I) ##STR1## and compounds having a number average molecular weight of not more than 10,000 and comprising, in their structure, said siloxane derivative; and an adhesive for adhering a wafer, which is usable in said production method. According to the method, package cracks can be significantly prevented.