The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 02, 1998
Filed:
Sep. 30, 1996
Applicant:
Inventor:
Masaichi Inaba, Ushiku, JP;
Assignee:
Nippon Mektron, Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01B / ;
U.S. Cl.
CPC ...
216 18 ; 427 96 ; 427 97 ; 430312 ; 430315 ; 430319 ;
Abstract
A desired circuit wiring pattern is formed by forming by plating means a conductive layer having excellent resistance at least to an etching solution on a metal layer which is removed in the post-process by etching means using a resist layer. A surface protective layer having a hole for exposing part of the circuit wiring pattern is formed on both sides of the circuit wiring pattern at a predetermined position as an external connection terminal portion. The circuit wiring pattern can be formed in multiple layers by coating the conductive layer with a circuit wiring layer of another conductive material and a bump is formed to fill the hole as required.