The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 02, 1998
Filed:
Mar. 05, 1997
Applicant:
Inventors:
Pietro Luigi Cavallotti, Milan, IT;
Adelio Monzani, Milan, IT;
Vittorio Sirtori, Milan, IT;
Giovanni Zangari, Pittsburgh, PA (US);
Assignee:
International Business Machines Corporation, Armonk, NY (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C25D / ; C25D / ; B23K / ;
U.S. Cl.
CPC ...
205177 ; 205225 ; 205226 ; 228208 ; 228209 ;
Abstract
A soldering method for soldering electronic components onto a copper (Cu) substrate using a tin (Sn) solder alloy. The method comprises in pretreating the Cu substrate by depositing a thin layer of zinc (Zn) before the deposition of the Sn solder alloy. This method greatly enhances the mechanical and electrical properties of the solder alloy, allowing the use of lead (Pb) free alloys such as tin-bismuth (Sn--Bi).