The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 26, 1998
Filed:
Oct. 02, 1996
Raymond Jonathan Thatcher, Rochester, MN (US);
Mark Kenneth Hoffmeyer, Rochester, MN (US);
David Peter Gaio, Rochester, MN (US);
Sukhvinder Singh Kang, Rochester, MN (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A package for containing a high speed electronic assembly has a small physical size, shielding, pluggability, and is capable of operating at multigigabit transmission rates. The package includes a module and a cover which covers at least the top of the module. An optical assembly and a circuit packaging are inserted into the module. The package, with an appropriate cover, can be removed and inserted without disturbing other packages secured on the board. The circuit packaging is electrically connected to the board through bump connectors, while the circuit packaging itself supplies a normal force for insuring the bump connectors are in contact with the board. The package is attached to the board using an attachment member which is separate from the bump connectors. The bump connectors facilitate high speed transmission. Alignment pins may be used to improve mechanical stability, provide feedback indicative of proper insertion, and to prevent bump connectors from contacting the board until the module is properly positioned. Electromagnetic interference shielding may be provided in the cover. The cover and various components of the module serve as heat sinks for the module. The cover, the pattern of the bump connectors and the positioning of the alignment pins may be selected/altered by an end user without affecting the construction of the module.