The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 26, 1998
Filed:
Jul. 29, 1996
Mehran Matloubian, Encino, CA (US);
Perry A Macdonald, Culver City, CA (US);
David B Rensch, Thousand Oaks, CA (US);
Lawrence E Larson, Bethesda, MD (US);
Hughes Electronics Corporation, El Segundo, CA (US);
Abstract
A microwave/millimeter wave circuit structure supports discrete circuit elements by flip-chip mounting to an interconnection network on a low cost non-ceramic and non-semiconductor dielectric substrate, preferably Duroid. The necessary precise alignment of the circuit elements with contact pads on the substrate network required for the high operating frequencies is facilitated by oxidizing the interconnection network, but providing the contact pads from a non-oxidizable material to establish a preferential solder bump wetting for the pads. Alternately, the contact bumps on the flip-chips can be precisely positioned through corresponding openings in a passivation layer over the interconnection network. For thin circuit substrates that are too soft for successful flip-chip mounting, stiffening substrates are laminated to the circuit substrates. In a self-contained antenna application in which two of the circuit substrates are laminated together, with an antenna on one side and circuitry on the other side, a metallic ground plane between the substrates also serves a stiffening function.