The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 26, 1998
Filed:
Oct. 24, 1995
Donald S Fritz, San Jose, CA (US);
Altera Corporation, San Jose, CA (US);
Abstract
An integrated circuit package in which the lead fingers are spaced away from the heat slug is provided. This allows the area of the heat slug to be used for a metallized contact area to serve as a power plane, ground plane, signal bus or the like. The metallized area is preferably insulated from the slug by a ceramic layer. The ceramic layer is preferably adhered to the slug by a nonconductive adhesive, and the metallized layer is preferably a sheet of metal that is preferably adhered to the ceramic layer by a preferably nonconductive adhesive. Nonconductive adhesive can also be used in place of the ceramic layer as an insulating layer. The package preferably also includes an interposer in the windowframe formed around the die by the ceramic layer, with the interposer adhered to the slug by a preferably nonconductive adhesive. More than one interposer, and more than one metallized layer or area, may also be provided.