The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 26, 1998
Filed:
Dec. 19, 1996
Takehito Inaba, Tokyo, JP;
NEC Corporation, Tokyo, JP;
Abstract
There is provided a semiconductor device sealed therearound with resin, including (a) a lead frame formed with an island region and a plurality of inner leads, tip ends of the inner leads defining a cavity as viewed perpendicularly to a plane of the chip, the island region being located in the cavity, (b) a chip mounted on the island region of the lead frame and having a plurality of electrodes thereon, and (c) wires for connecting the electrodes of the chip to the inner leads. The cavity is defined so that a wire for connecting inner leads to electrodes located at corners on a diagonal line D1 of the chip is shortest in length and a wire for connecting one of electrodes located at a corner on a diagonal line D2 perpendicular to the diagonal line D1 is longest in length. The present invention makes it possible to shorten a wire which would receive greatest impact from molten resin in the step of introducing molten resin into a space defined by upper and lower molds and enclosing the semiconductor device therein. Hence, it is possible to prevent shortcircuits between adjacent wires in the above mentioned step, thereby providing a resin-sealed type semiconductor device with high yield and high reliability.