The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 26, 1998
Filed:
Sep. 06, 1996
Yoshiaki Togawa, Ichihara, JP;
Masaaki Tsutsubuchi, Ichihara, JP;
Masahito Matsumoto, Ibaraki, JP;
Yukito Nakamura, Ibaraki, JP;
Takeo Kitayama, Takatsuki, JP;
Sumitomo Chemical Company, Limited, Osaka, JP;
Abstract
In a method of simulating flow behavior of a resin in a process for press-molding the resin by use of a press-molding machine comprising a press apparatus equipped with a hydraulic circuit, and first and second molds at least one of which is connected to the press apparatus, disclosed is a method comprising a step of determining, from a characteristic of the hydraulic circuit, an elastic coefficient of the press apparatus, and an apparent elastic coefficient of the resin, a true compression rate imparted to the resin by the press apparatus, and a step of sequentially analyzing, based on the true compression rate, flow behavior of the resin.