The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 19, 1998
Filed:
Sep. 30, 1994
Applicant:
Inventor:
Kazumi Ebihara, Satsuma-gun, JP;
Assignee:
Fujitsu Limited, Kawasaki, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ; H01L / ;
U.S. Cl.
CPC ...
437217 ; 437220 ;
Abstract
Process for manufacturing a leadframe that is adapted to enhance the adhesion between a stage 1 and a sealing resin without decreasing the bonding strength between the stage 1 and a chip 4; and a semiconductor device constructed by using such a leadframe. The leadframe comprises a body 1 constructed from at least two kinds of layer members, 11, 12, and 13, formed from different materials and laminated one on top of the other; the materials for the layer members 11, 12, and 13 being chosen to have different etching rates. Hollow spaces 15 are formed inside the layer member having the greatest etching rate of all the layer members.