The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 19, 1998
Filed:
Sep. 27, 1995
Marshall D Stone, San Jose, CA (US);
Martin E Garnett, Los Gatos, CA (US);
Michael J Mottola, San Jose, CA (US);
Hiu F Ip, San Jose, CA (US);
Micrel, Incorporated, San Jose, CA (US);
Abstract
Each die containing a resistive element which is to be trimmed has associated therewith a plurality of alignment targets. A cut mask having a trim pattern and an alignment key formed thereon is employed in a masking and etching step to trim the resistive element to a desired resistance. The number of links cut in the resistive element, and thus the final resistance thereof, depends on the particular positioning of the cut mask with respect to the die as determined by which of the alignment targets is aligned with the alignment key. For instance, aligning the alignment key with a first alignment target would result in cutting one link in the resistive element so as to achieve a first resistance value, while re-aligning the cut mask such that the alignment key aligns with another of the alignment targets would result in cutting two links in the resistive element so as to achieve a second resistance value. Since the trim of resistive elements may be adjusted to any one of many possible resistance values by simply changing the alignment of the cut mask with respect to the die, the need to have a separate cut mask for each of the possible trimmed resistance values is eliminated, thereby reducing costs.