The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 12, 1998
Filed:
Jan. 13, 1997
Toray Industries, Inc., , JP;
Abstract
Disclosed are a photosensitive resin composition essentially comprising 100 parts by weight of modified polyvinyl alcohol comprising a structural units of formulae (I), (II) and (III): ##STR1## wherein R represents a hydrocarbon group having 1 to 20 carbon atoms; X represents an aliphatic, alicyclic or aromatic divalent hydrocarbon group having 1 to 20 carbon atoms or a divalent group having at least one carboxyl group in the molecule thereof, the proportion of the structural unit of formula (I) being from 1 to 40 mol %, the total proportion of the structural units of formulae (II) and (III) being from 60 to 99 mol %, and the carboxyl equivalent attributed to the structural unit of formula (III) being from 0.3 to 5 mol/kg, (B) from 0.1 to 10 parts by weight of an unsaturated epoxy compound, (C) from 20 to 200 parts by weight of a polymerizable unsaturated compound having an ethylenical double bond in the molecule thereof, and (D) from 0.1 to 10 parts by weight of a photopolymerization initiator. A photosensitive resin composition containing modified polyvinyl alcohol obtained by reacting partially saponified polyvinyl alcohol having a degree of saponification of 60 to 99 mol % and a number average degree of polymerization of 300 to 2,000 with a carboxylic acid anhydride in a molten state is also disclosed. Additionally, and a process for producing a photopolymerizable resin composition comprising reacting partially saponified polyvinyl alcohol having a degree of saponification of 60 to 99 mol % and a number average degree of polymerization of 300 to 2,000 with a carboxylic acid anhydride in a molten state to prepare (A-2) modified polyvinyl alcohol and mixing modified polyvinyl alcohol (A-2) with (C) a polymerizable unsaturated compound having an ethylenical double bond in the molecule thereof, and (D) a photopolymerization initiator is disclosed. The photosensitive resin compositions provide a printing plate material having high sensitivity and highly precise image reproducibility, from which material is obtained a printing plate whose relief has excellent toughness. The use of the modified polyvinyl alcohol obtained by a molten reaction makes it easy to prepare a solution of a photosensitive resin composition.