The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 12, 1998
Filed:
Dec. 02, 1996
Applicant:
Inventor:
Kimiaki Shimokawa, Tokyo, JP;
Assignee:
Oki Electric Industry Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B / ;
U.S. Cl.
CPC ...
451 53 ; 451 41 ; 451 56 ; 451287 ;
Abstract
A polishing pad is conditioned using a conditioning disc whose temperature is controlled upon Chemical Mechanical Polish. The temperature of the polishing pad remains unchanged upon conditioning and uniform CMP can be carried out.
Shimokawa, Kimiaki. (1998). Method and apparatus for polishing wafer (U.S. Patent No. 5749772). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5749772
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile