The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 12, 1998
Filed:
Feb. 22, 1995
Applicant:
Inventor:
Akira Isobe, Tokyo, JP;
Assignee:
NEC Corporation, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
B24B / ;
U.S. Cl.
CPC ...
451 41 ; 451 56 ; 451285 ; 451287 ; 451443 ; 451444 ;
Abstract
A polishing apparatus is equipped with a wafer holder and a pad conditioner concurrently changed to working position over a polishing pad, and the polishing pad grinds the semiconductor wafer under concurrent cleaning operation thereon so as to enhance the throughput of the polishing apparatus: grooves are formed in a wafer carrier of the wafer holder for sufficiently supplying polishing slurry to the semiconductor wafer, and a guide wall is provided over the polishing pad so as to cause the polishing slurry to partly return to a central area of the polishing pad.