The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 05, 1998
Filed:
Nov. 24, 1995
Reinhold Bayerer, Reichelsheim, DE;
Asea Brown Boveri AG, Baden, CH;
Abstract
A power semiconductor module system includes a plurality of types of power semiconductor modules (310), which each contain one or more controllable power semiconductors (36, 37) and are each accommodated in a module housing (311) with power connections (313-317) and control connections which are passed to the outside, as well as a drive unit (325) for each of the power semiconductor modules (310), which drive unit (325) is accommodated in a separate housing (334) and can be detachably connected to the associated power semiconductor module in such a manner that the drive signals which are passed from the drive unit (325) at appropriate control signal outputs pass to the corresponding control connections of the power semiconductor module, the control connections of the power semiconductor modules (310) each being arranged in a first fixed-position three-dimensional configuration, and the control signal outputs of the drive units (325) each being arranged in a second fixed-position three-dimensional configuration which is superimposed on the first configuration. In the case of such a module system, a reduction is achieved on the drive side for the cost of storage and installation in that the first and second configurations are the same for all the power semiconductor modules (310) and drive units (325) and in that the various power semiconductor modules (310) and drive units (325) are distinguished by different wiring of the control connections and control signal outputs.