The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 05, 1998

Filed:

Aug. 20, 1996
Applicant:
Inventor:

Shoichi Iwasa, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ; H01L / ; H01L / ;
U.S. Cl.
CPC ...
257306 ; 252304 ;
Abstract

A semiconductor memory device comprises a plurality of memory cells on a semiconductor substrate, each including a transistor with a pair of impurity diffusion layers and a gate electrode, and a capacitor, a first insulating film covering the transistors, a plurality of parallel extending word lines formed on the substrate, each being connected to the gate electrode of the transistor of at least one selected memory cell, a plurality of bit lines, each connected to one of the pair of impurity diffusion layers of at least one selected memory cell through a first contact hole in the first insulating layer, each bit line formed with a conductive film on a top surface thereof and a second insulating film interposed therebetween, a lower electrode of the capacitor at a predetermined position on the first insulating film electrically connected to one of the bit lines and to the other of the pair of impurity diffusion layers through a second contact hole formed in the first insulating film, wherein the conductive film on the top surface of each of the bit lines is formed by a material having an etching rate lower than that of the first insulating film in etching the first insulating film for the second contact hole.


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