The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 05, 1998
Filed:
Mar. 26, 1997
Applicant:
Inventors:
Nobuyuki Akiyama, Hiratsuka, JP;
Fumitaka Kai, Miyazaki, JP;
Masahiko Maeda, Miyazaki, JP;
Hirofumi Hajime, Miyazaki, JP;
Naoki Yamada, Miyazaki, JP;
Assignee:
Komatsu Electronic Metals Co., Ltd., Kanagawa, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ;
U.S. Cl.
CPC ...
438 14 ; 438891 ; 438974 ; 438476 ;
Abstract
A method of making semiconductor wafers can prevent processing strain on peripheral portions of wafers caused by non-wax polishing using a template. This involves mirror chamfering or etching the peripheral portions of the wafers after the non-wax polishing step.
Akiyama, Nobuyuki. (1998). Method of making semiconductor wafers and semiconductor wafers made (U.S. Patent No. 5747364). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5747364
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile