The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 05, 1998
Filed:
May. 29, 1996
Robin E Gorrell, Eau Claire, WI (US);
Paul J Fischer, Eau Claire, WI (US);
W. L. Gore & Associates, Inc., Newark, DE (US);
Abstract
A method is provided for forming at least one raised metallic contact on an electrical circuit. Generally, this method includes the following steps: providing a composite base substrate which is defined by at least a first conductive layer, a dielectric material and a second conductive layer; removing a portion of the first conductive layer to expose the dielectric material; removing the exposed portion of the dielectric material to the second conductive layer, thereby forming a depression; depositing at least one layer of conductive material on at least side wall portions of the depression; removing the second conductive layer; and completely removing the dielectric material to said first conductive layer thereby forming a raised metallic contact which extends perpendicularly away from the first conductive layer.