The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 05, 1998
Filed:
Nov. 08, 1996
Applicant:
Inventors:
Zhong Hui-Hugh Fan, Plainsboro, NJ (US);
Aaron William Levine, Lawrenceville, NJ (US);
Satyam Choudary Cherukuri, Cranbury, NJ (US);
Steven A Lipp, Cranbury, NJ (US);
Assignee:
David Sarnoff Research Center, Inc., Princeton, NJ (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B / ;
U.S. Cl.
CPC ...
428426 ; 65 334 ; 65 40 ; 65 42 ; 65 43 ;
Abstract
The invention provides a method of bonding a glass substrate and a nonconductive substrate comprising the steps of: (a) contacting a surface of the nonconductive substrate which is coated with a field-assist bonding material with a conforming surface of the glass substrate; and (b) applying sufficient heat to the two substrates and sufficient voltage across the two substrates to bond the two substrates together.