The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 05, 1998

Filed:

Jul. 22, 1996
Applicant:
Inventors:

Takao Kasai, Saitama, JP;

Kenichi Yoshikawa, Tokyo, JP;

Shigeru Saito, Saitama, JP;

Masami Hoshi, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C / ;
U.S. Cl.
CPC ...
264234 ; 264669 ; 264670 ;
Abstract

This manufacturing method of a powder injection molded part includes the steps of using a binder composition containing at least 2 kinds of thermoplastic binder components having an evaporation temperature higher than the injection molding temperature and a different evaporation initiating temperature from each other, elevating the temperature of a molded body above the evaporation initiating temperature of the binder component having the lowest evaporation initiating temperature rapidly, removing the binder component having the lowest evaporation initiating temperature from the molded body by holding this temperature, and thereafter, removing all binder components by elevating up to a temperature not lower than the evaporation initiating temperature of the binder component having the highest evaporation initiating temperature. By this method, the form unstability of final parts, which is a problem of the prior art, is resolved, dimensional accuracy is satisfied, and it is possible to shorten debinding times.


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