The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 05, 1998

Filed:

Oct. 20, 1995
Applicant:
Inventors:

Paul L Bartley, West Newbury, MA (US);

Deborah A Fisher, Columbus, OH (US);

Assignee:

Lucent Technologies Inc., Murray Hill, NJ (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K / ;
U.S. Cl.
CPC ...
29840 ; 29830 ; 156295 ;
Abstract

A method of joining a metal heat sink pallet to a circuit board by electroplating a layer of solder on the mounting surface of the pallet, placing and holding the circuit board metal circuit paths firmly against the plated mounting surface of the pallet and heating the pallet until the solder melts and alloys with the circuit paths. A nitrogen gas bath is used to inhibit oxidation during heating and alloying and a flux is used to promote alloying. A bonding fixture accurately positions the circuit board with respect to the pallet and applies pressure in circuit path areas of interest during heating, alloying and cooling to accurately position the circuit board on the pallet and to promote a superior mechanical and electrical bond between the circuit paths and the pallet.


Find Patent Forward Citations

Bartley, Paul. (1998). Method for bonding circuit boards to pallets (U.S. Patent No. 5745987). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5745987

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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