The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 05, 1998
Filed:
Apr. 08, 1996
Okimasa Ohsawa, Kashiwa, JP;
Kuniaki Osada, Yokohama, JP;
Nobuyoshi Okato, Kawasaki, JP;
Tatsuo Katagiri, Kawasaki, JP;
Nippon Paper Industries Co., Ltd., Tokyo, JP;
Nippon Yakin Kogyo Co., Ltd., Tokyo, JP;
Abstract
A method of manufacturing a pulp molding die, by providing a superplastic material plate having a plurality of preformed through-holes, closing the plurality of preformed through-holes, heating the superplastic material plate under a pressurized atmosphere, forming the plate into a desired shape, and uncovering the plurality of preformed through-holes of the plate, thereby forming the pulp molding die.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile