The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 28, 1998
Filed:
Aug. 23, 1996
Eric Yuen-Jun Chan, Mercer Island, WA (US);
Mark William Beranek, Bellevue, WA (US);
The Boeing Company, Seattle, WA (US);
Abstract
A method and apparatus for aligning an optical fiber (120) with an optoelectronic hybrid device (112) and locking the optical fiber in the aligned position are disclosed. A fiber coated with an external layer of gold is threaded through a solder preform (130). The optical fiber (120) rests upon a ceramic substrate (104). The ceramic substrate also supports a device submount (108) that houses the optoelectronic device (112). The ceramic substrate (104) supports a resistor/heater formed of a thin film of nickel-chromium alloy (604). The resistor/heater supports a pad (609) formed of a layer of nickel (610) and a layer of gold (612). Located atop the pad (609) is the solder preform (130). Precise control of heating is provided by applying a predetermined voltage to the resistor/heater (122) for precise time periods, thereby eliminating the necessity of making temperature measurements during heating. As the resistor/heater (122) is energized, the solder preform is liquefied. An open loop search process that utilizes signal strength feedback is used to control the operation of an x-y-z micropositioning stage (328) that precisely positions an arm (306) that supports the optical fiber (120). The alignment system also includes a fixturing setup that includes a probe head (340) having multiple electrical probes (502a, 502b, 504a, 504b) and a vertical rod (506) that applies a downward force to the solder during manufacturing.