The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 28, 1998
Filed:
Mar. 25, 1996
Joseph Gerard Hoffarth, Binghamton, NY (US);
John Matthew Lauffer, Waverly, NY (US);
Issa Said Mahmoud, deceased, late of Austin, TX (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A multi-layer printed circuit board comprises a first metallic layer, a first Ta or Hf layer on one face of the first metallic layer, a first layer of Ta.sub.2 O.sub.5 or HfO on a face of the Ta or Hf layer opposite the first metallic layer, a second metallic layer on the Ta.sub.2 O.sub.5 or HfO layer opposite the Ta or Hf layer, a first dielectric layer on the first metallic layer opposite the Ta of Hf layer, and a second dielectric layer on the second metallic layer opposite the Ta.sub.2 O.sub.5 or HfO layer. A multi-layer printed circuit board is formed by adding the following layers to form the second capacitor. A third metallic layer on said second dielectric layer, a second Ta or Hf layer on a face of the third metallic layer, a second Ta.sub.2 O.sub.5 or HfO layer on a face of the second Ta or Hf layer opposite the third metallic layer, a fourth metallic layer on the second Ta.sub.2 O.sub.5 or HfO layer opposite the second Ta or Hf layer, and a third dielectric layer on the fourth metallic layer opposite the second Ta.sub.2 O.sub.5 or HfO layer.