The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 28, 1998
Filed:
Feb. 06, 1996
Reinhold Bayerer, Reichelsheim, DE;
Asea Brown Boveri AG, Baden, CH;
Abstract
A power semiconductor module (201) is disclosed comprising at least one semiconductor chip, which is arranged on a baseplate (202) and is surrounded by a housing (204) arranged above the baseplate (202), and which can be externally connected by means of connecting lugs (205). The connecting lugs (205) are electrically connected to the at least one semiconductor chip and are routed to the outside through corresponding through-passage openings (210) in the housing (204). An explosion of the module in the event of a disturbance is reliably prevented or its effect is largely attenuated as a result of the fact that the connecting lugs (205) are constructed as parts of connection laminates (206), which are arranged inside the housing (204) and parallel to the baseplate (202) and are mechanically connected to the latter over a large area.