The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 28, 1998
Filed:
Mar. 20, 1995
Yoshimitsu Kankawa, Shiga, JP;
Toshiki Nikaya, Osaka, JP;
Nippon Shokubai Co. Ltd., Osaka-fu, JP;
Abstract
An injection molding binder permitting formation of a molded article incapable of sustaining such defects as a crack or an expansion at the degreasing step and allowing the degreasing treatment to be completed quickly, an injection molding composition, and a method for the production of a sintered member are disclosed. The powder injection molding binder contains a polymer (I) which is obtained by polymerizing a monomer component composed of 50 to 100% by weight of a long side chain-containing monomer and 0 to 50% by weight of other polymerizable monomer. The powder injection molding composition comprises the binder, a binder auxiliary, and a powdery material capable of sintering. The method for the production of a sintered member comprises the steps of injection molding the composition, subjecting the molded mass to a degreasing treatment, and sintering the degreased molded mass.