The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 28, 1998
Filed:
Nov. 17, 1995
Applicant:
Inventor:
Donald S Fritz, San Jose, CA (US);
Assignee:
Altera Corporation, San Jose, CA (US);
Primary Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
438111 ; 438112 ; 438125 ;
Abstract
A leadframe integrated circuit package is provide with an interposer structure for electrically interconnecting a die with the leadframe. The interposer has a rigid substrate, which is mounted in the leadframe in place of a conventional integrated circuit die. Interposer bonding pads at the periphery of the substrate are connected to bond fingers of the leadframe, e.g., by wire bonding. The interposer bonding pads are electrically connected to the die using a network of routing lines connected to a central array of interposer array pads. The array of interposer array pads is connected to a corresponding array of die array pads on the die using metal bumps.