The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 28, 1998
Filed:
Jul. 11, 1996
Alex Bailey, Hampstead, MD (US);
Andrew J Piloto, Columbia, MD (US);
Deborah P Partlow, Export, PA (US);
Northrop Grumman Corporation, Los Angeles, CA (US);
Abstract
A thick film metallization compatible with low temperature cofired ceramics (LTCC) that displays very low microwave insertion losses commensurate with those of thin film gold. However, the disclosed metallization is applied similar to conventional metallizations by screen printing and has no limit to the number of layers achievable. The electrical performance of the metallization is attained by using a spherical metal particle shape and uniform particle size distribution in the thick film paste. The advantage of this invention is that superior microwave performance can be achieved in electronic packages without the cost and limitations imposed by thin film metallization techniques.