The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 28, 1998

Filed:

Jul. 09, 1997
Applicant:
Inventors:

Tadashi Kimura, Yokohama, JP;

Toshihide Kobayashi, Yokohama, JP;

Katsuhiko Sakurai, Yokohama, JP;

Kensuke Tani, Yokohama, JP;

Mitsuhiro Yoshida, Kanagawa-ken, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B27N / ;
U.S. Cl.
CPC ...
264109 ;
Abstract

A process is provided for producing a compression molded article of a lignocellulose type material by use of an organic polyisocyanate compound as a binder. The process comprises carrying out adhesion by use of the following components (A) an organic polyisocyanate, (B) an aqueous emulsion of a wax having a melting point ranging from 50.degree. C. to 160.degree. C., and (C) an organic phosphate ester derivative and optionally (D) water. The compression molded article can readily be released from the mold, and has excellent physical properties.


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