The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 28, 1998
Filed:
May. 17, 1996
Sadahiko Yokoyama, Tokyo, JP;
Masatoshi Iji, Tokyo, JP;
NEC Corporation, Tokyo, JP;
Abstract
The method of recovering valuables from a printed wiring board on which electronic components are mounted, includes the steps of (a) removing electronic components from a printed wiring board on which the electronic components are mounted, (b) polishing a surface of the printed wiring board from which the electronic components have been removed in the step (a), (c) milling the printed wiring board a surface of which has been polished in the step (b), and (d) separating milled portions of the printed wiring board into portions mainly including copper and portions mainly including resin and filler. The electronic components recovered in accordance with the method includes valuables such as gold having greater grade than natural minerals. The copper recovered in accordance with the method includes no impurities such as solder, and thus can be reclaimed as metal resource having high added value. The residual glass fiber and resin scarcely includes impurities such as solder, and thus can be reused as a filler to be used for building materials and construction materials.