The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 28, 1998
Filed:
Jan. 13, 1997
Mohi Sobhani, Encino, CA (US);
Hughes Electronics, Los Angeles, CA (US);
Abstract
A connector having a pair of structural substrates that each contain mechanically raised dimples and adjacent mating flexible interconnect circuits. The structural substrate has one or more structural dimples formed therein that protrude above one surface. A metallization pattern on the substrate overlays each of the structural dimples to provide additional structural support. The flexible interconnect circuits each comprise a dielectric substrate fabricated as a flat flexible circuit having conductive traces formed on top and bottom sides thereof, respectively, that terminate in contact areas. The conductive traces are configured to conform to the shapes of the respective dimples of the structural substrates when they are mated. The mated flexible interconnect circuits are compressed by the structural substrates using plates or other securing members so that contact therebetween is made by the conductive traces adjacent the contact areas. The contact areas of the flexible interconnect circuits conform to and mate with the structural dimples without the need to form dimples in the flexible interconnect circuits.