The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 28, 1998
Filed:
Oct. 16, 1995
Michitaka Urushima, Tokyo, JP;
NEC Corporation, , JP;
Abstract
The method for fabricating a semiconductor device disclosed is to bond an inner lead and a pad of a semiconductor chip together using a bonding tool. The bonding tool has a bottom peripheral end being formed in either a circular arc shape with a curvature or a sloped surface shape with a chamfer angle. The inner lead is placed over the pad of the semiconductor chip, and the bonding tool is placed at a location inside an edge of a passivation film formed at a peripheral portion of the pad. The inner lead and the pad of the semiconductor chip are pressed together by using the bonding tool. This enables the reliable bonding of the inner lead and the semiconductor chip pad without requiring to use a bump structure.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile