The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 21, 1998
Filed:
Mar. 23, 1995
Mitsubishi Chemical Corporation, Tokyo, JP;
Abstract
A resin composition containing 50 to 99% by weight of component A, which is a copolymer of ethylene and .alpha.-olefin, and 1 to 50% by weight of component B, which is a high-pressure low-density polyethylene. The component A has (a) a melt flow rate (MFR) of 2 to 30 g/10 min., (b) a density of not more than 0.935 g/cm.sup.3, and (c) a single peak of elution volume indicated by an elution curve obtained by temperature rising elution fractionation, the peak corresponding to a temperature within a range of from 20.degree. C. to 85.degree. C., and the elution curve satisfying a relationship in which the ratio H/W is not less than 1 when H represents the height of the peak and W represents the width of the elution curve at half of the height H. The component B has (a') a melt flow rate of 0.1 to 20 g/10 min., (b') a density of 0.915 to 0.93 g/cm.sup.3, ('c) a memory effect (ME) of not less than 1.6, and (d') a melt tension (MT) of not less than 1.5 g. The resin composition is advantageously usable as a laminate material having improved workability, and excellent properties with respect to low-temperature heat sealability, heat sealing strength and hot tack.