The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 21, 1998
Filed:
Dec. 06, 1995
Kuniaki Tsurushima, Kanagawa-ken, JP;
Kabushiki Kaisha Toshiba, Kawasaki, JP;
Abstract
The present invention relates to a method and apparatus for forming ball electrodes on electrode pads provided on a package. Solder balls and the electrode pads can be aligned with each other with high precision, and the cost of processing can be decreased. An installation apparatus for balls which holds the solder balls by vacuum suction is preferably formed of heat-resisting glass or other transparent material through which the balls may be observed. The solder balls are aligned with electrode pads provided on a package, and brought into contact with the electrode pads, with the solder balls and the electrode pads capable of being viewed through the installation apparatus from the top. Thereafter, a light beam is radiated from a light beam radiation light through the installation apparatus, thereby successively melting soldering paste on the electrode pads. In such a manner, the solder balls are fixed to the electrode pads. Consequently, ball electrodes are precisely formed.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile