The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 21, 1998
Filed:
Sep. 20, 1996
Austin S O'Malley, Rehoboth, MA (US);
Texas Instruments Incorporated, Dallas, TX (US);
Abstract
An interconnect system for providing electrical connection to bond pads of a semiconductor device (14) includes a socket (18) having a plurality of conductors (16) and a carrier assembly (10) receivable in the socket (18) carrying a semiconductor device (14). The carrier assembly comprises a substrate assembly (12) and a latch assembly (22, 122, 222). The substrate assembly (12) includes a substrate (12a) having a complaint membrane (12f) and a plurality of contact bumps (12i) on a top surface of the complaint membrane (12c) for contacting bond pads on the semiconductor device (14). The force applying latch assembly (22, 122, 222) applies pressure in making a temporary electrical connection between contact bumps (12i) and the bond pads of semiconductor device (14). Latch assembly (222) comprises a latch (232) which cooperates with a spring (231) to place a force on a lid (224, 324, 424) which in turn places a force on the semiconductor device (14). An ejector member (250, 350) is mounted on the lid to apply a force on the semiconductor device to separate the semiconductor from the lid upon removal of the lid from the carrier assembly (10).