The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 14, 1998
Filed:
Mar. 14, 1996
Eiichi Asano, Usui-gun, JP;
Takayuki Aoki, Usui-gun, JP;
Toshio Shiobara, Usui-gun, JP;
Peter Flury, Himmelried, CH;
Wolfgang Scharf, Grenzach-Wyhlen, DE;
Tadashi Okada, Oberwil, CH;
Shin-Etsu Chemical Co., Ltd., Tokyo, JP;
Ciba-Geigy Corporation, Tarrytown, NY (US);
Abstract
An epoxy resin composition comprising (A) 20-80 parts by weight of an epoxy resin, (B) 20-80 parts by weight of a curing agent, (C) 0.1-50 parts by weight of a phosphorus-containing flame retardant, and (D) 200-1,200 parts by weight of an inorganic filler cures into products having improved high-temperature exposure resistance, flame retardancy, and reflow cracking resistance. The composition eliminates blending of antimony trioxide and brominated compounds and is useful in encapsulating semiconductor devices for imparting high-temperature reliability.