The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 14, 1998
Filed:
Nov. 28, 1995
Applicant:
Inventors:
Atsuhito Hayakawa, Yokkaichi, JP;
Yasuyuki Murata, Yokkaichi, JP;
Yoshinori Nakanishi, Yokkaichi, JP;
Norio Tohriiwa, Yokkaichi, JP;
Assignee:
Shell Oil Company, Houston, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L / ; C08G / ;
U.S. Cl.
CPC ...
523443 ; 525117 ; 525524 ; 528 97 ; 528 98 ; 528103 ;
Abstract
The invention relates to an epoxy resin composition for semiconductor encapsulation comprising at least an epoxy resin, hardener, inorganic filler, and accelerator, wherein said epoxy resin is one which is composed of about 20 to about 90 parts by weight of 4,4'-bisphenol F type epoxy resin and about 10 to about 80 parts by weight of either a polyhydric phenolic type epoxy resin which has slightly polar hydrocarbon groups (Z) lying between the phenyl nuclei, or a biphenol type epoxy resin.