The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 07, 1998

Filed:

Jul. 05, 1996
Applicant:
Inventors:

Takeshi Yakou, Tokyo, JP;

Tsunenobu Satoi, Yokohama, JP;

Eiji Takaki, Ibaraki-ken, JP;

Toshio Akiyama, Yokohama, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ; H01L / ;
U.S. Cl.
CPC ...
136256 ; 29850 ; 29868 ; 257459 ; 438 98 ; 156 47 ; 156166 ; 156167 ; 156250 ; 156267 ;
Abstract

A linear body disposing method capable of extending a large number of wires above a work efficiently provides a plurality of collector wires on a substrate coated with a photosensitive film. The plurality of collector wires are held at a predetermined interval therebetween before one end of the substrate. The plurality of held collector wires are drawn to the other end of the substrate simultaneously. The other end of each of said drawn collector wires is fixed on the substrate. Subsequently, while the collector wires are held at the one end of the substrate, one end of each of the collector wires is fixed to the one end of the substrate. Thereafter, the collector wires are cut.


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