The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 31, 1998

Filed:

Jun. 04, 1996
Applicant:
Inventors:

Francois De Buyl, Brussels, BE;

Patrick Leempoel, Brussels, BE;

Assignee:

Dow Corning S.A., Seneffe, BE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G / ;
U.S. Cl.
CPC ...
528 17 ; 528 30 ; 528 33 ; 528 34 ;
Abstract

The specification describes and claims a composition curable in presence of atmospheric moisture to an elastomeric body, comprising (A) the product formed by mixing a polymeric material having at least two groups bonded to silicon which are hydroxyl or hydrolysable (eg alkoxy) groups and an alkoxysilane curative and (B) a compound according to the general formula M�OR!.sub.x �OR'!.sub.y where M represents a metal having a valency of 4 selected from Group IVB of the Periodic Table and is preferably titanium, x has a value from 0 to 1, y has a value from 3 to 4 and (x+y)=4, R' represents a monovalent tertiary aliphatic hydrocarbon group and R represents a monovalent linear aliphatic hydrocarbon group having 1 to 6 carbon atoms which is different from R'. Preferred compounds (B) are those in which R' represents C(R.sup.2 R.sup.3 R.sup.4) in which each of R.sup.2, R.sup.3 and R.sup.4 represents a monovalent aliphatic chain having 1 to 6 carbon atoms, the most preferred groups R' being tertiary butyl and t-amyl groups. The compositions cure without need for the presence of a chelating agent and the preferred compositions cure quickly and do not yellow.


Find Patent Forward Citations

Loading…