logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 5733598 B1

PDFFull Text
Date of Patent:
Mar. 31, 1998

Filed:

Mar. 10, 1997

Flexible wiring board and its fabrication method

Applicant:
Inventors:

Naoki Sera, Tsuyama, JP;

Toshiharu Fukui, Nara, JP;

Kouji Tanabe, Katano, JP;

Futoshi Matsui, Tsuyama, JP;

Assignee:

Matsushita Electric Industrial Co., Ltd., Osaka, JP;

Attorney:

Ratner & Prestia

Primary Examiner:

Michael Lusignan

Assistant Examiner:

Brian K Talbot

Int. Cl.
CPC ...
B05D / ;
U.S. Cl.
CPC ...
427 96 ; 427 98 ; 427405 ;
Abstract

A flexible wiring board includes a printed conductive circuit layer formed on an insulating film, a metallic layer formed on the printed conductive circuit layer, and an insulating layer formed on the metallic layer. A method of making a flexible wiring board includes the steps of forming a conductive circuit layer by screen printing a wiring pattern using a conductive paste, baking the printed wiring pattern, and forming a metallic layer on the printed conductive circuit layer by a plating method.

Find Patent Forward Citations

Sera, Naoki. (1998). Flexible wiring board and its fabrication method (U.S. Patent No. 5733598). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5733598

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…