The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 31, 1998
Filed:
Jul. 05, 1996
Applicant:
Inventors:
Assignee:
Kabushiki Kaisha Toyota Chuo Kenkyusho, Aichi-ken, JP;
Primary Examiner:
Int. Cl.
CPC ...
B23K / ; C22C / ;
U.S. Cl.
CPC ...
420562 ; 420557 ;
Abstract
A lead-free solder alloy comprises 0.8 to 5.0% inclusive by weight of Ag, not less than 0.1% by weight of In, not less than 0.1% by weight of Bi, the total amount of In and Bi being not more than 17% by weight and the balance of Sn and inevitable impurities. The other lead-free solder alloy further contains 0.1 to 10% by weight of Sb. These solder alloys have low melting point and narrow melting range, and furthermore, they show excellent wettability and mechanical characteristics.