Unpackaged semiconductor testing using an improved probe and precision

Abstract

A portable integrated circuit die testing system that offers a cost-effective solution for electrically testing bare, unpackaged, integrated circuit chips or die. The system provides for direct electrical interconnection of die of various sizes and thicknesses to an automatic tester without wire bonding or packaging of the semiconductor chip or die. The system includes an X-Y table that is adjustable in horizontal X and Y directions. A contact platform is disposed above the X-Y table that has an opening therein, and is movable in a vertical direction relative to the X-Y table. An adjustment member is coupled to the contact platform for finely adjusting the movement thereof in the vertical direction. A die holder is secured to the X-Y table for holding the die that is to be tested, and in response to movement of the X-Y table. A vacuum connection is provided for drawing a vacuum on the tested die to secure it in the die holder. A probe flexible printed circuit is secured to the contact platform that extends into the opening in the contact platform and includes a plurality of bumps that mate with contact pads on the die. An interface flexible printed circuit is coupled between the probe flexible printed circuit and the automated test equipment. A microscope is used to align the bumps of the printed circuit to the contact pads on the die, which completes an electrical path between the die and the automated test equipment.