The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 24, 1998
Filed:
Jul. 30, 1996
Yomiyuki Yama, Tokyo, JP;
Masao Kobayashi, Tokyo, JP;
Jun Shibata, Tokyo, JP;
Shinji Baba, Tokyo, JP;
Masaki Watanabe, Tokyo, JP;
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Abstract
A semiconductor device having improved heat dissipation property and electrical characteristics and applicable to an integrated circuit having a multiplicity of electrodes, and a method of fabricating the semiconductor device are disclosed. A surface of a semiconductor chip (1) on which a bump (2) is formed is in face to face relation to a surface of a circuit substrate (3) on which a land (5) is formed. A polyimide tape (6) and a TAB lead (7) constitute a TAB tape. The bump (2) and the land (5) are electrically connected to each other through the flat TAB tape. The land (5) is electrically connected to an external connection electrode (4) through an interconnecting line within the circuit substrate (3). The TAB lead (7) extending from the bump (2) to the land (5) is reduced in length, and the signal through the TAB lead (7) accordingly has improved electrical characteristics. The use of the TAB tape permits the semiconductor device to be applied to the semiconductor chip (1) having the multiplicity of bumps (2).