The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 24, 1998
Filed:
Apr. 18, 1996
Applicant:
Inventor:
Atsushi Yamamori, Tokyo, JP;
Assignee:
NEC Corporation, , JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
437190 ; 437192 ; 4372 / ;
Abstract
A method of forming a tungsten plug is disclosed in which a blanket tungsten layer 16 is deposited on a conductive layer including a titanium nitride film 15 and thereafter etched back using SF.sub.6 plasma until the surface of the titanium nitride (TIN) film 15 is exposed. At this time, fluorine in SF.sub.6 adheres to the surface of the TiN film. The wafer thus treated is maintained in a vacuum atmosphere and then a removing step is performed to remove fluorine from the surface of the TiN film.
Yamamori, Atsushi. (1998). Method for fabricating semiconductor device having buried contact (U.S. Patent No. 5731225). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5731225
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile