The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 24, 1998
Filed:
Dec. 19, 1996
Hanno Melzner, Grosshelfendorf, DE;
Helmut Joswig, Burlington, VT (US);
Wolfgang Muller, Bolton Valley, VT (US);
Siemens Aktiengesellschaft, Munich, DE;
Abstract
A method for producing a contact hole to a first doped region of a first conductivity type in a semiconductor wafer having doped regions of the first and of a second conductivity type, includes producing a first doped region in a substrate having a surface, and bounding the first doped region with insulation regions at least at the surface of the substrate. A diffusion barrier layer is produced leaving at least the first doped region free and covering a second doped region of a second conductivity type. An undoped silicon layer is deposited over the entire surface. A doped region is selectively produced in the silicon layer by implantation, and the doped region overlaps a region for a contact hole. Undoped portions of the silicon layer are selectively removed relative to the doped region. An insulation layer is produced over the entire surface. A contact hole is opened in the insulation layer by selective anisotropic etching relative to the doped region of the silicon layer.