The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 17, 1998

Filed:

May. 02, 1996
Applicant:
Inventor:

Misao Hironaka, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01S / ;
U.S. Cl.
CPC ...
372 36 ; 372 46 ;
Abstract

A semiconductor laser device includes a semiconductor laser chip; a heat sink; a solder layer adhering the semiconductor laser chip to the heat sink; a lower electrode on the semiconductor laser chip including a non-alloying layer not alloyed with the solder layer and opposite the heat sink and directly opposite to a center line in a longitudinal direction of a light emitting region of the semiconductor laser chip and alloying layers on regions of the lower electrode, except for the region of the non-alloying layer, alloyed with the solder layer. Internal stress due to the difference in coefficients of thermal expansion of the semiconductor laser chip and the heat sink and applied to the light emitting region is reduced, and GaAs destruction at the light emitting region is prevented.


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