The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 17, 1998

Filed:

Apr. 29, 1996
Applicant:
Inventors:

Gary Carl Johnson, Tempe, AZ (US);

David Patrick Stumbo, Scottsdale, AZ (US);

Steven Richard Young, Gilbert, AZ (US);

Michael Anderson, Phoenix, AZ (US);

Assignee:

Motorola Inc., Schaumburg, IL (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H03H / ; H01L / ;
U.S. Cl.
CPC ...
333193 ; 3103 / ; 29 2535 ;
Abstract

A method for packaging an acoustic wave filter (102). The method includes a step of providing a first wafer (100). The first wafer (100) supports acoustic wave transduction and propagation. The method also includes steps of processing the wafer (100) to provide transducer patterns (18, 18') thereon and disposing a seal ring (25) on the wafer (100). The seal ring (25) completely encloses active areas allowing portions of each bond pad to extend outside of the seal ring. The method further includes steps of disposing a second wafer (40) atop the seal ring (25) and the first wafer (100), sealing the second wafer (40) to the first wafer (100), dicing the second wafer (40) with a saw that provides a first kerf width, whereby portions of the second wafer (40) overlying bonding pads (20) of the transducer patterns (18, 18') are removed and dicing the first wafer (100) with a saw that provides a second kerf width narrower than the first kerf width to provide a packaged SAW die.


Find Patent Forward Citations

Loading…