The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 17, 1998
Filed:
Nov. 18, 1996
Applicant:
Inventor:
Jin Sung Kim, Cheongju, KR;
Assignee:
LG Semicon Co., Ltd., Cheongju, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ;
U.S. Cl.
CPC ...
257667 ; 257687 ; 257738 ; 257790 ; 257795 ; 257730 ; 257693 ; 257678 ;
Abstract
A semiconductor package substrate and a ball grid array (BGA) semiconductor package using the same include a cavity formed in the substrate, anti-cracking bumpers on the inner substrate surface adjacent to the cavity and a plurality of holes and recesses in the substrate, whereby delamination and cracking which may occur during the credibility checkup can be prevented, thereby improving the package reliability.
Kim, Jin. (1998). Semiconductor package substrate and ball grid array (bga) semiconductor (U.S. Patent No. 5729050). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5729050
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