The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 17, 1998
Filed:
Oct. 23, 1995
Derryl D Allman, Colorado Springs, CO (US);
Steven S Lee, Colorado Springs, CO (US);
AT&T Global Information Solutions Company, Dayton, OH (US);
Hyundai Electronics America, San Jose, CA (US);
Symbios Logic Inc., Fort Collins, CO (US);
Abstract
A method of planarizing a non-planar substrate, such as filling vias and contact holes, spreads a suspension of a conducting material suspended in a liquid on a substrate. The suspension includes an organometallic material, preferably with particles of a polymerized tin or indium alkoxide. The material is spread by spinning the substrate after applying the suspension. The carrier liquid and organic groups are removed by baking and curing at elevated temperatures, thereby depositing the conductive material on the substrate in a layer which is more planar than the substrate and which has regions of greater and lesser thickness. A relatively brief etch step removes conductive material from regions of lesser thickness, leaving material filling vias or contact holes.