The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 17, 1998
Filed:
Nov. 15, 1994
John R Saxelby, Jr, Maynard, MA (US);
Walter R Hedlund, III, Lowell, MA (US);
VLT Corporation, San Antonio, TX (US);
Abstract
A method for encapsulating portions of a circuit formed on a substrate. The substrate has two faces and perimeter sides. Encapsulating surrounds, in molding compound, a portion of one of the faces of the substrate and a portion of the sides of the substrate, and during encapsulation a portion of the one face of the substrate that bears conductive pads is left unencapsulated. An encapsulated circuit including a substrate having two faces and perimeter sides around the faces and a circuit formed on the substrate. The substrate also includes conductive pads that are formed on a portion of one of the faces near one of the sides and are connected to the circuit. An integrally formed encapsulating mass encapsulates all of the one face except in the region of the pads, all of the other face except in a region opposite to the region of the pads, and all of the sides.